Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

Image of an anode surface doped with Pt nanoparticles.

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.

The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.