Oficinas +34 91 148 8267
Tel. +34 682 715 975 (click para llamar)
Business Park Europa Empresarial
C/Rozabella 8,
Edificio Paris, oficina 12
28250 Las Rozas (Madrid)
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Image of an anode surface doped with Pt nanoparticles.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Image of an anode surface doped with Pt nanoparticles.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
Contact layers under a solder ball imaged at 5 keV with the InBeam SE detector for topographic contrast (left), and the In-Beam f-BSE detector for material contrast (right).
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
The beam deceleration improves imaging at low landing energies. Surface features in an Al flake become visible only at a landing energy of 500 eV (right). The multi-detector system enables simultaneous detection of BSE (left) and SE (right) signals.
Banco de trabajo de nanofabricación avanzada para su laboratorio de investigación.
Una plataforma Plasma FIB-SEM para seccionamiento profundo y la más alta resolución para el análisis de fallas en microelectrónica.
Dirección:
Business Park Europa Empresarial
C/Rozabella 8,
Edificio Paris, oficina 12
28250 Las Rozas (Madrid)
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