TESCAN AMBER X

A unique combination of Plasma FIB and field-free UHR

FE-SEM for multiscale materials characterization

As the first SEM manufacturer to commercialize integrated xenon plasma FIB with the SEM, TESCAN proudly presents TESCAN AMBER X.

TESCAN AMBER X is a new FIB-SEM solution that combines high throughput plasma-assisted ion milling with improved ultra-high resolution (UHR) field-free SEM optics, a combination ideally suited for materials characterization over a significantly wider sample range.

TESCAN AMBER X target applications include milling and characterization of large cross-sections (up to 1 mm in width), multiscale, multi-modal FIB-SEM tomography, and contamination-free preparation of micro- and nano-structures for subsequent testing or characterization.

• High throughput, large area FIB processing up to 1 mm
• Ga-free microsample preparation
• Ultra-high resolution, field-free FEG-SEM imaging and analysis
• In-lens SE and BSE detection
• Resolution optimization for high-throughput, multi-modal FIB-SEM tomography
• Superior field of view for easy navigation
• Essence™ easy-to-use, modular graphical user interface