SuperView W1

The SuperView W1 Nano 3D Optical Surface Profilometer from Chotest Technology Inc. is an advanced optical measurement system designed for three-dimensional surface analysis with nanometer resolution. It utilizes interferometry and non-contact measurement technology to accurately capture the topography, roughness, and microgeometry of materials and components.


Thanks to its high acquisition speed and powerful 3D analysis software, the SuperView W1 provides highly reliable, detailed surface maps and metrological parameters. It is an ideal solution for applications in microelectronics, semiconductors, optics, advanced materials, and quality control in high-precision manufacturing processes.


  • Standard field of view: (0.98*0.98) mm
  • Scanning range: ≤10 mm
  • Resolution: 0.1 nm
  • Scenario measurement accuracy: 0.3%
  • Repeatability of the stage measurement: 0.08% 1σ

Applications

The SuperView W1 3D optical surface profilometer is an ideal instrument for sub-nanometer measurements of various precision parts. Based on the principle of white light interference technology, combined with a precision Z-direction scanning module and a 3D modeling algorithm, it non-contactly scans the object's surface and generates a 3D image. After processing and analysis of the 3D image by the XtremeVision software, a series of 2D and 3D parameters are obtained, reflecting the surface quality of the object. The SuperView W1 is an easy-to-use precision optical instrument with powerful analysis functions for all types of surface shape and roughness parameters. Thanks to its unique light source, it can measure various precision parts with both smooth and rough surfaces.

Measurement and analysis of the surface shape and profile characteristics of various products, components and materials, such as flatness, roughness, waviness, appearance, surface defects, abrasion, corrosion, gaps, holes, stages, curvature, deformation, etc.

3C Electronics - Sapphire Crystal

Features
Model No. SuperView W1
Light source LED blanco
Video system 1024×1024
Objective lens Standard: 10X (optional: 2.5X, 5X, 20X, 50X, 100X)
Optical zoom Standard: 0.5X Optional: 0.375X, 0.75X, 1X
Standard field of view 0,98 × 0,98 mm
Lens turret Standard: 3-hole manual turret (Optional: 5-hole motorized turret)
XY object table Size 320×200 mm
Moving range 140×100 mm
Load capacity 10 kilos
Control Method - Motorized
Tilt (manual) ±4°
Z-axis focus Travel range 100 mm
Control Method - Motorized
Z-stroke scan range 10 mm
Repeatability of surface shape* 0,1 nm
RMS Roughness Repeatability* 0,005 nm
Step height measurement* Accuracy: 0.3%; Repeatability: 0.08%(1σ)
Scanning speed at a resolution of 0.1 nm 1,85 μm/s
Weight 140 kg
Size (length x width x height) 700x606x920mm
Stage measurement Temperature 0 °C ~ 30 °C, fluctuation <2 °C/60 min
Humidity 5%~95% RH, non-condensing
Vibration VC-C or better
Software noise assessment * 3σ≤4 nm
Compressed air 0.6 MPa, oil-free, water-free, 6 mm hose diameter
AC power supply 100~240 V, 50/60 Hz, 4 A, 300 W
Other - No strong magnetic field, no corrosive gas

Note:

* 1 Use EPSl mode to measure the 0.2 nm Sa silicon wafer in a laboratory environment; single-line 80 µm filter for a full field of view

* 2 Measure the 0.2 nm Sa silicon wafer in a laboratory environment according to ISO 25178.

* 3 Measure the standard 5 µm step height block in a laboratory environment according to ISO 1060-1:2000* 4 When the software noise assessment is 4 nm ≤ 3 σ ≤ 10 nm, the RMS repeatability of roughness is revised to 0.015 nm, the accuracy of the step height measurement is revised to 0.7%, and the repeatability of the step height measurement is revised to 0.12%; When the software noise assessment is 3 σ> 10 nm, the environment does not meet the equipment usage requirement and the site needs to be changed.

Parameters
Standard
ISO 4287-1997
A>amplitude Main section - Pp, Pv, Pz, PC, Pt, Pa, Pq, Psk, Pku
Aspereza - Rp, Rv, Rz, Rc, Rt, Ra, Rq, Rsk, Rku
W>aviness - Wp, Wv, Wz, Wc, Peso, Wa, Wq, Wsk, Wku
interval Main section - PSm, Pdq
Aspereza - RSm, Rdq
W>aviness - WSm,Wdq
S>substance Main section - Pmr, Pdc
Aspereza - Rmr, Rdc, Rmr(Rz/4)
IN
Top Main section - PPc
Aspereza - RPc
IN
ISO 13565 ISO 13565-2 Rk, Rpk, Rvk, Mr1, Mr2, A1, A2, Rpk, Rvk
ISO 12085 Roughness graph - R, AR, R×, No
Gráfico de W>aviness> - W,AW,W×,Wte
Another graph - Rke, Rpke, Rvke
AMS >B46.1 2D - Rt, Rp, Rv, Rz, Rpm, Rma×, Ra, Rq, Rsk, Rku, tp, Htp, Pc, Rda, Rdq, RSm, Peso
DIN EN ISO 4287-2010 Perfil original - Pa, Pq, Pp, Pv, Pz, Pc, Pt, PSk, PKu, PSm, PPc, Pdq, Pdc, Pmr,
Aspereza - Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,RPc,Rdq,Rdc,Rmr
W>aviness - Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr
Standard JIS B0601-2013 Perfil original - Pa, Pq, Pp, Pv, Pz, Pc, Pt, PSk, PKu, PSm, PPc, Pdq, Pdc, Pmr,
Aspereza - Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr
W>aviness - Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr
GBT 3505-2009 Perfil original - Pa, Pq, Pp, Pv, Pz, Pc, Pt, PSk, PKu, PSm, PPc, Pdq, Pdc, Pmr,
Aspereza - Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr
W>aviness - Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr
3D parameters
Standard
ISO 25178 Height - Cuadrado, Ssk, Sku, Sp, Sv, Sz, Sa
Function - Smr,Smc,S×p
Space - Exit, Street, Standard
Composite parameters - Sdq,Sdr
Volumen - Vm, Vv, Vmp, Vmc, Vvc, Vvv
Form - Spd, Spc, S10z, S5p, S5V, SDA, Sha, SdV, Shv
Functional - Sk, Spk, Svk, Smr1, Smr2, Spq, Svq, Smq
ISO 12781 Plain - FLTt,FLTp,FLTv,FLTq
EUR 15178N Amplitude - Sa, Cuadrado, Talla, Ssk, Sku, Esp, Sv, St
Space - Str,Std,Sal
Composite parameters - Sdq, Sds, Ssc, Sdr, Sfd
Area, Volume - Smr,Sdc
Function - Sc, Spk, Svk, Sr1, Sr2, Spq, Svq, Smq
Functional - Sbi, Sci, Svi
EUR 16145 Y Amplitud - SaSq, Sy, Sz, Ssk, Sku
Mixed parameters - Ssc,Sdq
Functional - Sbi, Science
Space - Sdsrw
Dureza - Hs,Hvol
ASME B46.1 3D - St,Sp,Sv,Sq,Sa,Ssk,Sku,SWt

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